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1
TOETS: Work Package 1
In: The European Nanoelectronics Forum 2011 ; https://hal-lirmm.ccsd.cnrs.fr/lirmm-00653039 ; The European Nanoelectronics Forum 2011, Nov 2011, Dublin, Ireland. 2011 ; http://www.catrene.org/web/forum2011/ (2011)
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2
Wireless Wafer Test for Iterative Testing During System Assembly
In: 3D-Test: Testing Three-Dimensional Stacked Integrated Circuits ; https://hal-lirmm.ccsd.cnrs.fr/lirmm-00537849 ; 3D-Test: Testing Three-Dimensional Stacked Integrated Circuits, Nov 2010, Austin, Texas, United States. 1st IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits, 2010 ; http://www.ieee-tttc.org/ebshistory/2010/2010-06-14%203D-Test10%20CfP.html (2010)
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3
System and Method for Wirelessly Testing Integrated Circuits
In: https://hal-lirmm.ccsd.cnrs.fr/lirmm-00767777 ; Spain, Patent n° : EP 08290891 WO 2010031879 (A1). 2008, pp.N/A (2008)
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4
Wireless Test Structure for Integrated Systems
In: ITC'2008: International Test Conference ; https://hal-lirmm.ccsd.cnrs.fr/lirmm-00375077 ; ITC'2008: International Test Conference, Oct 2008, Santa Clara, CA, United States. pp.N/A, 2008, ⟨10.1109/TEST.2008.4700704⟩ (2008)
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5
Power Supply Investigation for Wireless Wafer Test
In: LATW'08: 9th Latin-American Test Workshop ; https://hal-lirmm.ccsd.cnrs.fr/lirmm-00260205 ; LATW'08: 9th Latin-American Test Workshop, Mar 2008, Puebla, Mexico. pp.165-170 (2008)
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